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Laser Processing
Laser processing technology, as a core method in modern advanced manufacturing, has been widely applied across various industrial fields—including cutting, welding, marking, and surface treatment—thanks to its high precision, non-contact nature, and exceptional flexibility.
Comparison of laser processing with traditional machining methods:
Technical specifications | Laser Processing | Mechanical Processing | Electrical Discharge Machining | Plasma Processing |
Processing Principle | Photothermal/Photochemical | Mechanical Cutting | Electrochemical Removal | Arc Melting |
Processing Power | None | Big | Tiny | China |
Precision | High (micrometer-level) | Medium (0.01 mm) | High (micrometer-level) | Low (0.1 mm) |
Material Applicability | Wide | Restricted | Conductive material | Metal |
Tool wear | None | Severe | China | Severe |
1. The Basic Principles of Laser Processing
The core of laser processing technology lies in leveraging the thermal or photochemical effects generated by the interaction between a high-energy laser beam and the material, enabling material removal, joining, or modification. When the laser is focused onto the material's surface, photon energy is absorbed by electrons and converted into heat, causing an abrupt and dramatic rise in local temperature within an extremely short time frame (ranging from nanoseconds to femtoseconds). This intense heating leads to melting, vaporization, or even plasma formation. Depending on the energy density and duration of the laser exposure, the interaction between the laser and the material can be divided into the following stages: heating → melting → vaporization → plasma formation → radiative and conductive heat dissipation.
Diamond waistline marker | Wafer Scribing and Cutting |
Laser processing systems typically consist of five major components: the laser source, beam delivery system, processing head, motion system, and control system. The laser source, as the core component, determines the fundamental characteristics of the process; the beam delivery system—such as optical fibers and mirrors—guides the laser beam to the processing area; the processing head includes focusing optics and auxiliary gas nozzles; the motion system enables relative movement between the laser beam and the workpiece; and the control system coordinates all these components to carry out the machining operation smoothly. Modern laser processing systems also integrate real-time monitoring and quality feedback modules, such as molten pool observation and acoustic emission detection, ensuring process stability and reliability.
With advancements in laser technology, control algorithms, and materials science, laser processing continues to push the boundaries of performance. The application of ultrashort lasers (picosecond and femtosecond) has significantly reduced the heat-affected zone, enabling "cold processing." Beam-shaping techniques—such as flat-top and annular beams—optimize energy distribution, enhancing cutting quality and welding stability. Moreover, multi-wavelength hybrid processing and laser-arc hybrid technologies have further expanded the range of applications. Meanwhile, the integration of artificial intelligence has paved the way for intelligent optimization of processing parameters and real-time defect prediction, driving laser processing toward greater automation and sophistication.
2. Main Technical Classifications of Laser Processing
Laser processing technology can be categorized into four major types—material removal, material joining, material modification, and additive manufacturing—depending on their underlying mechanisms and intended applications, with each technique offering unique advantages in industrial settings.
Laser cutting and punching technology
Laser cutting and punching are the most mature and widely applied laser processing techniques, using a high-energy-density laser beam to melt or vaporize materials, while an auxiliary gas is employed to blow away the molten material and create the cut.
Ceramic Drilling | Pericardial incision |
Laser Welding Technology
Laser welding joins materials by locally heating them until they melt, then allowing the molten material to re-solidify and form a bond. It features a high depth-to-width ratio and minimal thermal distortion.
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Laser Soldering and Welding | Laser Plastic Welding |
Laser Surface Treatment Technology
Laser surface treatment alters the microstructure or composition of a material's surface layer through controlled
Carbon Fiber Surface Modification | Application of Micro-Channel Anti-Glare on Glass Surfaces |
heating, enhancing properties such as wear resistance and corrosion resistance.
Laser Marking
Laser marking creates permanent markings through surface modification or minute material removal.
Embedding cassettes, slide labels | Sensitive plastic touchless marker |
Laser Inner Carving
Laser engraving involves focusing laser beams inside materials like glass, crystal, or plastic to create microscopic "explosion points," forming three-dimensional patterns.
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Embedding cassettes, slide labels | Sensitive plastic touchless marker |
Laser Additive Manufacturing Technology
Laser Additive Manufacturing (3D printing) through Layer-by-layer accumulation Directly forming complex parts from materials.
The selection of laser processing technology requires a comprehensive consideration of material properties, processing requirements, and economic factors. Fiber lasers are the preferred choice for metal cutting and welding, while cold-source 355nm solid-state pulsed lasers are often used for heat-sensitive plastics. Ultra-precise machining, meanwhile, demands the use of ultrafast lasers. With the advancement of hybrid processing and intelligent technologies, laser-based manufacturing continues to evolve toward greater efficiency, higher precision, and broader applicability.
3. Technical Specifications of Lasers for Laser Processing
As the core component of laser processing systems, the performance parameters of lasers directly influence the quality, efficiency, and application scope of the process. Different processing techniques place varying demands on the laser's power, wavelength, beam quality, and other characteristics.
Laser power:
For continuous lasers, it refers to the energy continuously output by the laser, measured in watts (W).
For pulsed lasers, average power and peak power are typically used for specification. Average power equals the energy of a single pulse multiplied by the repetition rate.
Wavelength:
Wavelength (λ) affects the material's absorption rate and processing accuracy.
Beam quality:
Beam quality is typically expressed using M², where an ideal M² value is 1. The better the beam quality, the smaller, rounder, and sharper the resulting beam spot will be after beam shaping processes such as beam expansion or collimation. For many precision applications, high beam-spot quality is essential.
Pulse parameters:
Typical pulse widths for pulsed lasers include nanoseconds, sub-nanoseconds, picoseconds, and femtoseconds. The shorter the pulse duration, the smaller the thermal impact on the material being processed.
Repetition frequency:
The lasers used for processing typically operate in a high-frequency range, with options ranging from kHz to MHz.
Single-pulse energy: For different applications, the typical energy range is available from uJ to J.
Laser processing parameters must be selected based on material properties (such as metals, ceramics) and processing objectives (e.g., cutting, drilling, surface treatment).
4. Typical Lasers Used in Laser Processing
CNI offers laser wavelengths typical for laser processing applications, including 808 nm, 980 nm, 1030 nm, 1064 nm, 532 nm, 355 nm, and 266 nm. Pulse durations are available in the ranges of ms, ns, ps, and fs.
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Nanosecond laser | Picosecond laser | Femtosecond laser |
Welcome everyone to visit www.cnilaser.com to learn more.
Changchun New Industries Optoelectronics Technology Co., Ltd.
Address: No. 888 Jinhu Road, High-Tech Zone, Changchun, 130103, P.R.China
International Tel:+86-431-85603799
Email: sales@cnilaser.com
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